CuMo Wafer for LED Chip Heat sink

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Description

Specification:

材质 Composition	Mo: 85±1 wt%; Cu: balance				W: 80±1 wt%; Cu: balance
Item	2 inch	4 inch	5 inch	6 inch	2 inch	4 inch	5 inch	6 inch
直徑 Diameter (mm)	50.8 mm 2 inch	101.6 mm 4 inch	127 mm 5 inch	152.4 mm 6 inch	50.8 mm 2 inch	101.6 mm 4 inch	127 mm 5 inch	152.4 mm 6 inch
厚度 Thickness (μm)	100~200 ±10	100~200 ± 10	100~200 ± 10	100~200 ± 10	100~200 ±10	100~200 ± 10	100~200 ± 10	100~200 ± 10
供货状态 Delivery State	退火态; Annealed
表面状态 Surface State	轧制表面, 类镜面，磨光表面，电镀表面，(按照客户要求). Rolled surface，like mirror surface，grinding surface,plating surface. (according to the buyer's required)
表面粗糙度 Surface roughness, Ra (μm)	0.04～0.1
平面度 Flatness (μm)	20～50	50~80	80~100	100~150	20～50	50~80	80~100	100~150
TTV Total Thickness Variation(μm)	2～15 (15Cu85Mo); 2~12 (20Cu80Mo)
密度 Density (g/cm3)	9.87~9.99				9.80~9.95
相对密度 Relative Density %TD	>99.3% (15Cu85Mo); 99.5% (20Cu80Mo)
热膨胀系数 Coefficient of Thrmal Expansion(10-6/K)	5.6~6.0				5.8~6.98
热导率 Thermal Conductivity (W/mK)	187～240				215～300
比热容 Specific Heat Capacity (J/kgK)	300				320
维氏硬度 Vickers Hardness (HV10)	160~260				145~280

Heat Sinks Advantages

- High thermal conductivity

- Excellent hermeticity

- Excellent flatness, surface finish, and size control

- Semi-finished or finished (Ni/Au plated) products available

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CuMo Wafer for LED Chip Heat sink

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