MoCu Substrate for Semiconductor Heat Sink
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Description
Thickness: Min.: 0.025mm
Specifications:
| Model | Density (g/cm3) | Relative Density （%TD) | CTE(ppm/K) | TC(W/m.K) |
| Mo70Cu30 | 9.7 | >99% | 7.6~8.5 | 190~200 |
| Mo60Cu40 | 9.6 | >99% | 9.2~9.4 | 200~220 |
| Mo50Cu50 | 9.5 | >99% | 10.2~10.5 | 250~250 |
Heat Sinks Advantages
· High thermal conductivity
· Excellent hermeticity
· Excellent flatness, surface finish, and size control
· Semi-finished or finished (Ni/Au plated) products available
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MoCu Substrate for Semiconductor Heat Sink
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